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Short pulse laser processing machine [for drilling and cutting silicon wafers, etc.!]

A short-pulse laser processing machine used for drilling and cutting silicon wafers!

The "Short Pulse Laser Processing Machine" is a processing machine that is applied to drilling, cutting of silicon wafers, and laser patterning of thin-film solar cell materials due to its features such as high output and fine processing. Additionally, it is used for cutting and drilling of lithium battery metal films, substrate cutting, and sapphire cutting. 【Features】 ■ Output: 20W, Pulse Width: 100ps ■ Peak Power Output: 300kW ■ Frequency: Adjustable from 30kHz to 1000kHz ■ Pulse Energy: 300μJ@1ns ■ Beam Quality: M2 < 1.3 *For more details, please request materials or view the PDF data available for download.

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